Microelectronic Assembly
 Advanced Dicing Technology |
Semiautomatic and fully automatic dicing
saws for dicing ceramics, gallium arsenide and silicon. High performance dicing blades. |
 Blue M |
Batch ovens for curing die attach materials.
Inline vertical curing ovens. Microbatch curing and process
ovens. High performance temperature cycling and temperature humdity chambers featuring scroll refrigeration. Themal shock testing equipment. |
 DAGE |
Bond testing systems for wire pull, ball shear, die shear and wafer bump shear. High resolution, high magnification XRAY systems for microelectronic assemblies and semiconductor devices. |
 Datacon |
High speed, flexible, automated die bonding systems for microelectronic, photonic and flip chip device assembly. Custom assembly equipment for microelectronic modules. |
 Kulicke and Soffa |
Manual wire ball and wedge bonders. Gold and aluminum bond wire. Wire bond capillaries. |
 March Plasma Systems |
Batch and inline plasma cleaning and treatment systems for micro electronic assemblies, photonic assemblies, semiconductor and medical devices. |
 Qualmark |
HALT (highly accelerated life test) and HASS (highly accelerated stress screening) test equipment and services for microelectronic assemblies |
 Semiconductor Equipment Corporation |
Manual and semiautomatic die bonding systems for microelectronic and flip chip assembly. Wafer to film frame mounting systems. Dicing tape. Hot gas rework equipment. |
 Tenney |
Temperature cycling and temperature humidity chamber for testing of electronic devices and assemblies. |